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Electronic Assembly Fabrication, by Charles Harper
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* Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition
* Non-specialists guide to assembly fabrication--no advance degrees or math background necessary
- Sales Rank: #789193 in Books
- Published on: 2002-04-10
- Original language: English
- Number of items: 1
- Dimensions: 9.10" h x 2.07" w x 6.20" l, 2.65 pounds
- Binding: Hardcover
- 672 pages
From the Back Cover
YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS
Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:
* Chips
* Boards
* Solders
* Packages
* Interconnections
* Substrates
* Deposition
* Cleaning
* Coating
* The latest environmental rules and constraints
ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.
About the Author
CHARLES A. HARPER is the President of Technology Seminars, Inc., an organization which provides educational training courses in electronic packaging and manufacturing to business and industry. He also had an earlier esteemed career with Westinghouse in this field. Widely recognized as one of the leaders in this industry, he has authored over a dozen highly respected books and is among the founders and past presidents of the International Microelectronics and Packaging Society (IMAPS). He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series, a widely used book series in the electronics industry. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he has also served as Adjunct Professor.
Most helpful customer reviews
0 of 0 people found the following review helpful.
Good book for those in and outside the industry
By J. Allison
As a mechanical engineer working in an increasingly electronic world I find I have to continue to stretch my knowledge. So I bought this book to learn more about the making of computer chips. This is a great book that covers all the bases on the processes and practices. In fact, recently I had actual IC fab issues on my product and this booked helped me understand what I was dealing with.
0 of 0 people found the following review helpful.
SOLDERING PROCESS
By MIKE
GOOD BOOK ON IC CHIP ASSEMBLY AND SOLDER REFLOW CHAPTER 3. HAS SURFACE MOUNT AND THROUGH HOLE CHIPS IN DETAIL. EXPLAINS BOARD MOUNTING OF CHIPS AND DOUBLE SIDED BOARDS. LAMINATES FOR THE BOARD SHOWING STRENGTHS OF BOARDS. THE BOOK USES COPPER AND FOIL LAYOUTS.
0 of 0 people found the following review helpful.
Five Stars
By edt
"Shipped promptly and arrived exactly as advertised."
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